Content of all the projects undertaken during academic educational pursuits.
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Nov 29, 2025 - Jupyter Notebook
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wire-bonding
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A hands-on exploration of semiconductor packaging — covering package types, ATMP processes, thermal simulation of flip-chip BGA packages, reliability testing, and 3D package cross-section modeling using ANSYS Electronics Desktop (AEDT).
thermal-simulations ansys-mechanical wire-bonding semiconductor-packaging ansys-aedt flip-chip-bga atmp package-modeling
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Apr 2, 2026
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