When building latest 4.0.2 for aarch64 and then signing some app, the tools issue warnings:
# sbsign --cert cert.pem --key my.key aarch64/apps/printenv.efi
warning: data remaining[42496 vs 52747]: gaps between PE/COFF sections?
warning: data remaining[42496 vs 52752]: gaps between PE/COFF sections?
Signing Unsigned original image
# sbverify --cert cert.pem aarch64/apps/printenv.efi.signed
warning: data remaining[44344 vs 54600]: gaps between PE/COFF sections?
Signature verification OK
Is that known? It seems harmless in practice but it leaves strange feelings, specifically as I just had to sort out various issues with gaps for arm binaries, though caused by downstream build procedures.
When building latest 4.0.2 for aarch64 and then signing some app, the tools issue warnings:
Is that known? It seems harmless in practice but it leaves strange feelings, specifically as I just had to sort out various issues with gaps for arm binaries, though caused by downstream build procedures.